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Facility

Physical Metallurgy and Materials Design Facility

The PMMD Lab is equipped with the following resources:

Materials Processing Capabilities

  • An arc-melting furnace with suction casting functionality (MRF model ABJ-338-1), enabling the production of small-scale samples for prototype alloy testing.
  • Various tube furnaces for precise heat treatment design.
  • Ultra-high temperature furnace reaching upto max. 2200 °C

Materials Thermal Mechanical Testing Systems - Gleeble

  • The Gleeble 3500 Dynamic Thermal Mechanical Testing System is a shared resource available to the PMMD Lab since 2025. Located within the Department of Mechanical Engineering and Materials Science, the system's acquisition was supported by the U.S. Department of Energy, Nuclear Program, through a successful collaborative proposal led by Professor Heng Ban and other faculty members in the department including Prof. Wei Xiong as the co-principal investigator.
  • The PMMD Lab also has access to another Gleeble system at Carnegie Mellon University (CMU) avaialble since 2024. Professor Wei Xiong was one of the co-principal investigator on the successful Defense University Research Instrumentation Program (DRUIP) grant through Office of Naval Research led by Professor Bryan Webler at CMU that secured funding for this system.

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Computational Tools

  • Full access to all commercial Thermo-Calc thermodynamic and diffusion kinetic databases for materials and processing design.
  • Dedicated small clusters for in-house ICME (Integrated Computational Materials Engineering) code development.
  • Priority access to the Center for Simulation and Modeling (SaM) at Pitt for high-performance computing, including ab initio quantum mechanical calculations using software like Quantum Espresso.

Thermal Analysis

  • A Netzsch Instruments high-temperature differential scanning calorimeter (max. 1600 °C) and a TA Instruments quenching dilatometer (heating rate up to 2500 K/s, cooling rate up to 4000 K/s). This system allows for the determination of phase transformation temperatures and the creation of CCT and TTT diagrams, which are crucial for model calibration and understanding solidification behavior.

PMMD Lab Facility Access & Collaboration

The PMMD Lab is a specialized facility and is not a shared resource. Therefore, access is granted on a case-by-case basis and must be approved directly by Prof. Wei Xiong.

Training & Usage

  • Training: For simpler systems, training may be provided by a PMMD Lab manager. However, for complex equipment, a lab member will be assigned to work on your samples.
  • Access & Collaboration: The lab welcomes collaborative opportunities, including those that lead to joint publications. However, due to limited resources and manpower, access cannot always be guaranteed and will be determined on an individual basis.

Materials Characterization in Nanoscale Fabrication and Characterization Facility (NFCF)

Prof. Wei Xiong's lab has full access to NFCF. As a hub for advanced research in materials science, metallurgy, and manufacturing—including metals, ceramics, high-temperature alloys, high-entropy alloys, steels, and lightweight materials—our facility provides comprehensive support for research and innovation. The NFCF is a state-of-the-art, 8,000-ft² user facility located in Benedum Hall. Our facility is divided into two main sections:

  • Characterization Laboratory
  • Fabrication (Cleanroom) Suite

We provide access to a wide array of advanced equipment and expert support for faculty, researchers, and students working on cutting-edge materials research.

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Why Use Our Facility?

Our center is optimized for interdisciplinary research in materials characterization, focusing on:

  • High-resolution electron and probe microscopy for metals, ceramics, steels, and novel alloys.
  • Precise thermal, mechanical, and chemical analysis of high-temperature and high-performance materials.
  • Micro/nanoscale patterning and thin-film device fabrication.
  • Training and technical support for beginners and experts.

If you have any ideas for collaboration, please contact Prof. Wei Xiong to advance your materials science and design projects!

Characterization Equipment

Imaging and Microstructure Analysis

  • FEI Scios FIB/SEM: Dual Beam Focused Ion Beam with EDS and EBSD for microstructural analysis, site-specific sample prep.
  • Apreo SEM: High-resolution scanning electron microscope with EDS and EBSD.
  • Zeiss Sigma 500 VP FE-SEM: Analytical SEM for detailed surface studies and microanalysis.
  • JEOL JEM-2100F TEM: 200 kV transmission electron microscope for nanostructure characterization.
  • Electron Probe Micro Analyzer (EPMA): Quantitative elemental analysis and mapping.
  • Environmental TEM: In situ observation of materials under various environments.
  • FEI Titan Themis G2 200 STEM: Probe Cs-corrected scanning TEM for atomic-resolution imaging.

Scanning Probe Techniques

  • Dimension Icon AFM: Atomic Force Microscope for nanoscale surface characterization.

Thermal Analysis

  • DSC250 Differential Scanning Calorimeter
  • STA 6000 Simultaneous TGA/DSC

Spectroscopy

  • Horiba UVISEL Spectroscopic Ellipsometer
  • Optical Microscopes (in multiple facility locations)
  • LabRAM Soleil Raman Microscope

X-Ray Analysis

  • PANalytical Empyrean XRD: Powder and thin-film X-ray diffraction.
  • Bruker XRD: Additional XRD capabilities.
  • Epsilon XRF: X-ray fluorescence for elemental composition.
  • PHI X-Ray Photoelectron Spectrometer (XPS): Surface chemical analysis.

Sample Preparation

  • VibroMet 2 Vibratory Polisher
  • Denton Sputter Coater for SEM Prep
  • E-Prep 4x Grinder/Polisher
  • PDMS Preparation Area
  • PIE Tergeo-EM Plasma Cleaner
  • VacuPrep Epoxy Impregnation System

Fabrication (Cleanroom) Capabilities

Lithography

  • Raith EBPG5150 100kV Electron Beam Lithography
  • Raith e-LiNE E-Beam Lithography
  • Heidelberg MLA100 & MLA150 Direct Write Lithography
  • Quintel Q4000 Mask Aligner
  • YES HMDS Oven
  • Zeiss Axio Imager Optical Microscope
  • Nanoscribe 3D Lithography System

Thin Film Deposition

  • Angstrom COVAP Thermal Evaporator
  • PECVD (Plasma Enhanced Chemical Vapor Deposition)
  • Thermionics Electron Beam Evaporator
  • Hybrid Sputter/Evaporation System (AJA)
  • Plassys E-Beam Evaporation
  • PE-ALD & Anric AT410 ALD (Atomic Layer Deposition)
  • Angstrom Sputtering System
  • Parylene Deposition Coater

Dry Etching

  • Trion Reactive Ion Etcher (RIE)
  • APEX ICP-RIE Etcher (Cl and F chemistries)
  • Plasma Asher (March500)

Film Analysis & Profilometry

  • Filmetrics F40 Thin Film Analyzer
  • Bruker DektakXT Surface Profiler
  • Keyence VHX-X1 Digital Microscope
  • Keyence VK-X3000 3D Surface Profiler
  • Optical Microscopes (Cleanroom and SB06)

Thermal Processing

  • Rapid Thermal Annealer (Solaris 100)
  • Oxidation/Annealing Tube Furnace

Miscellaneous

  • All Chemical Fume Hoods
  • ADT 7122 Wafer Dicer

Note: Some equipment is located outside the cleanroom and does not require cleanroom access. Please consult the facility map for room locations.

Access and Training

  • Orientation: Complete the NFCF orientation to become an approved user.
  • Training: After orientation, sign up for equipment training to gain access.
  • Scheduling: View equipment availability and schedule time using the facility scheduling tool.

Contact and Location

  • Address:
    NFCF Lab, SB 60-63, Benedum Hall
    3700 O'Hara Street, Pittsburgh, PA 15261

Facility Map (PDF)

For further information on access, training, and specific techniques, visit our NFCF webpage, or directly drop a line to Prof. Wei Xiong for collaboration discussions.